It can be used as a solder replacement for bonding heat sensiti.
Silver epoxy adhesive.
The mg chemicals 8331 is a two part silver filled epoxy adhesive with good conductivity and a faster working time than mg chemicals 8331s adhesive to bond electronic devices form conductivity seals and cold solder heat sensitive materials.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
Low linear shrinkage upon cure.
Cures at room temperature.
The 8331 silver conductive epoxy adhesive.
It cures at low temperatures to avoid damage to electronic equipment and bonds well to most materials.
8331 is an electrically conductive silver filled two part epoxy adhesive.
Silver filled electrically conductive epoxy adhesive.
Resists vibration impact thermal cycling.
This adhesive bonds very well to a variety of surfaces.
8331 is an electrically conductive silver filled 2 part epoxy adhesive.
This product allows for quick cold soldering repairs.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.
8330s is an electrically conductive silver filled 2 part epoxy adhesive with a long working time.
It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive.
One component heat curing silver conductive epoxy adhesive.
Serviceable from 4k to 250 f.
Excellent peel and shear strength.
It has a convenient 1 to 1 ratio ten minutes work life and a moderate curing rate.
It is smooth non sagging thixotropic and bonds well to a wide variety of substrates.